Home
Plasmatechnique
Glossary of terms
FAQ
Products
Services
Links/representatives
References
Download
Trade fairs
Contact
Approach
About us
BGA
Acronym for Ball Grid Array, a grid array of small solder hemispheres (bumps) on the bottom of an integrated circuit, designed to connect the circuit to an underlying circuit board. A clean surface of the solder is crucial for a good connection in the soldering process. Disturbing oxides or impurities can be removed by a plasma pre-treatment.
Home
|
Plasmatechnique
|
Glossary of terms
|
FAQ
|
Products
|
Services
|
Links/representatives
|
References
|
Download
|
Trade fairs
|
Contact
|
Approach
|
About us
© 2007 Diener electronic
North America
