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Cleaning copper
Copper surfaces in micro-electronic applications have to be perfectlyclean before joining processes such as bonding and soldering to provideoptimal wetting by the solder and electrical contacting. Thus, coppercontacts are often pretreated in electronic industry prior to thecontacting step by plasma to clean them from surface oxide and organiccompounds.
首頁
|
電漿技術
|
專業術語
|
常見問題
|
電漿系統
|
連結/地區代理商
|
滿意客戶
|
下載圖片
|
巡迴展覽
|
保持連絡
|
如何前往
|
簡介
© 2007 Diener electronic
North America
