diener electronic  |  Plasma-Surface-Technology Plasma Plasma systems Surface-Technology
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 Principle of plasma process 
A vacuum is generated in a recipient with the aid of a vacuum pump. At apressure of approx. 0,1 mbar process gas is introduced into the chamber.The generator is switched on and the process gas is ionised in therecipient. The material is exposed to the plasma. Fresh process gas issupplied continuously to the plasma process and contaminated gas isextracted. After treatment times which are as a rule between 1-30 min.,the chamber is vented and the material treated is removed.

   
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