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Sputtering
Designation for plasma cleaning involving the bombardment of high energyions from a plasma onto a surface, thereby removing surface atoms. Inpure sputter processes, Argon is often employed as process gas. Plasmacleaning by sputtering is also designated “micro-sandblasting”.Furthermore, sputtering is applied in thin film technology as a methodfor the generation of vapour phases with definite composition bybombardement of a sample of the desired material (the so-called target).
首頁
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電漿技術
|
專業術語
|
常見問題
|
電漿系統
|
連結/地區代理商
|
滿意客戶
|
下載圖片
|
巡迴展覽
|
保持連絡
|
如何前往
|
簡介
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